Exclusive

Publication

Byline

Location

US Patent Issued to Roku on June 30 for "Content system with lighting device calibration feature" (California, New Hampshire, Colorado Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,222, issued on June 30, was assigned to Roku Inc. (San Jose, Calif.). "Content system with lighting device calibration feature" was invente... Read More


US Patent Issued to Lutron Technology on June 30 for "Load control system comprising linear lighting fixtures" (Michigan, Pennsylvania, Massachusetts Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,223, issued on June 30, was assigned to Lutron Technology Co. LLC (Coopersburg, Pa.). "Load control system comprising linear lighting fixtu... Read More


US Patent Issued to Zuma Array on June 30 for "Dynamic configuration and control of a speaker-light array" (British Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,224, issued on June 30, was assigned to Zuma Array Ltd. (London). "Dynamic configuration and control of a speaker-light array" was invented... Read More


US Patent Issued to Excillum on June 30 for "Electromagnetic pump" (Swedish Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,225, issued on June 30, was assigned to Excillum AB (Kista, Sweden). "Electromagnetic pump" was invented by Ulf Lundstrom (Kista, Sweden). ... Read More


US Patent Issued to xLight on June 30 for "Light source system and method of operation" (California Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,226, issued on June 30, was assigned to xLight Inc. (Palo Alto, Calif.). "Light source system and method of operation" was invented by Davi... Read More


US Patent Issued to NITTO DENKO on June 30 for "Wiring circuit board and method of producing the wiring circuit board" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,227, issued on June 30, was assigned to NITTO DENKO Corp. (Osaka, Japan). "Wiring circuit board and method of producing the wiring circuit ... Read More


US Patent Issued to LG INNOTEK on June 30 for "Circuit board and semiconductor package comprising same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,228, issued on June 30, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board and semiconductor package comprising same"... Read More


US Patent Issued to INTERNATIONAL BUSINESS MACHINES on June 30 for "Tamper-respondent assemblies with individualized chemical mixtures for security" (New York, Connecticut, Idaho Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,229, issued on June 30, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Tamper-respondent assemblies with individual... Read More


US Patent Issued to DAIKIN INDUSTRIES on June 30 for "Substrate structure" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,230, issued on June 30, was assigned to DAIKIN INDUSTRIES LTD. (Osaka, Japan). "Substrate structure" was invented by Kazuma Tanimukai (Osak... Read More


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on June 30 for "Printed circuit board and substrate including electronic component embedded therein" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,231, issued on June 30, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board and substrate in... Read More